Add 2021 year in the file header Copyright line.
Change-Id: I09f7bef1f746c429ff308286169354e58648a1cd
Signed-off-by: Yann Gautier <yann.gautier@st.com>
Move the generic part of DDR node in SOC dtsi file.
DDR dtsi files only include the part configured by CubeMX tool.
Signed-off-by: Patrick Delaunay <patrick.delaunay@foss.st.com>
Signed-off-by: Nicolas Le Bayon <nicolas.le.bayon@foss.st.com>
Change-Id: I8c211e9782604da32aeaab98d0ef75fb1cd9c58d
Some STM32MP1‐based boards, like Seeed Studio’s SoM‐STM32MP157C, have
the SoC connected to the PMIC via I2C2 instead of I2C4 (which is used on
the official ST development boards). This commit brings TF‑A one step
closer to boot on such boards.
Signed-off-by: Grzegorz Szymaszek <gszymaszek@short.pl>
Change-Id: Iec9c80f29ce95496e8f1b079b7a23f1914b74901
FMC node bindings are modified to add EBI controller node.
FMC driver and associated device tree files are modified
to support these new bindings.
Change-Id: I4bf201e96a1aca20957e0dac3a3b87caadd05bdc
Signed-off-by: Christophe Kerello <christophe.kerello@st.com>
Signed-off-by: Lionel Debieve <lionel.debieve@st.com>
There is one dtsi file per SoC version:
- STM32MP151: common part for all version, Single Cortex-A7
- STM32MP153: Dual Cortex-A7
- STM32MP157: + GPU and DSI, but not needed for TF-A
The STM32MP15xC include a cryptography peripheral, add it in a dedicated
file.
There are 4 packages available, for which the IOs number change. Have one
file for each package. The 2 packages AB and AD are added.
STM32157A-DK1 and STM32MP157C-DK2 share most of their features, a common
dkx file is then created.
Some reordering is done in other files, and realign with kernel DT files.
The DDR files are generated with our internal tool, no changes in the
registers values.
Change-Id: I9f2ef00306310abe34b94c2f10fc7a77a10493d1
Signed-off-by: Yann Gautier <yann.gautier@st.com>
Yann Gautier
Nicolas Le Bayon
Grzegorz Szymaszek
Christophe Kerello